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Vol.2, No.1, 2023: pp.1-7



Mesut Bitkin1

, Abdullah Sadık Tazegül1

, Osman Okumuşer1

, Furkan Şahin1


Abdurrahman Ekin1

, Ömer Sinan Şahin2

1Tüfekçioğulları Machine Company R&D Center, Türkiye
2Konya Technical University, Faculty of Engineering and Natural Sciences, Department of Mechanical Engineering, Türkiye

Received: 13 December 2022
Revised: 22 February 2023
Accepted: 6 March 2023
Published: 31 March 2023


The product formed after the cream is spread between the wafer sheets is called a wafer block. The wafer block can have a minimum of 3 layers (2 sheets, 1 cream) and a maximum of 9 layers (5 sheets, 4 creams). The temperature of the wafer block before entering the cooling tower is 30-35°C. After the cooling process is completed, it cannot be reduced to the outlet temperature (~16°C) and the temperature is not homogeneously distributed. Especially the middle regions are hot. In this paper, the homogeneous temperature distribution is aimed at by using the CFD method. CFD analysis of three predetermined designs was performed using Solidworks / Flow Simulation software. The first design is the one currently used. In the second design, a design improvement has been made to reduce the effect of vortices in dead zones. In the third design, a design improvement was made to positively affect the flow rate in the upper region where the evaporator and fan are located. In the second design, the temperature difference on the wafer block is reduced by 0.02°C compared to the current design. The third design decreases by 0.13°C compared to the second design.


Wafer block cooling towers, computational fluid dynamics, wafer block cooling, wafer production lines, wafers


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© 2023 by the authors. This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License (CC BY-NC 4.0)

Volume 3
Number 2
June 2024.



How to Cite

M. Bitkin, A.S. Tazegül, O. Okumuşer, F. Şahin, A. Ekin, Ö.S. Şahin, Effect of Geometry Upon Cooling Characteristics of Wafer Block Coolers. Advanced Engineering Letters, 2(1), 2023: 1-7.

More Citation Formats

Bitkin, M., Tazegül, A. S., Okumuşer, O., Şahin, F., Ekin, A., & Şahin, Ö. S. (2023). Effect of Geometry Upon Cooling Characteristics of Wafer Block Coolers. Advanced Engineering Letters2(1), 1–7.

Bitkin, Mesut, et al. “Effect of Geometry Upon Cooling Characteristics of Wafer Block Coolers.” Advanced Engineering Letters, vol. 2, no. 1, 2023, pp. 1–7,

Bitkin, Mesut, Abdullah Sadık Tazegül, Osman Okumuşer, Furkan Şahin, Abdurrahman Ekin, and Ömer Sinan Şahin. 2023. “Effect of Geometry Upon Cooling Characteristics of Wafer Block Coolers.” Advanced Engineering Letters 2 (1): 1–7.

Bitkin, M., Tazegül, A.S., Okumuşer, O., Şahin, F., Ekin, A. and Şahin, Ö.S. (2023). Effect of Geometry Upon Cooling Characteristics of Wafer Block Coolers. Advanced Engineering Letters, 2(1), pp.1–7. doi: 10.46793/adeletters.2023.2.1.1.