Journal Menu
Last Edition
Journal information

Vol.2, No.1, 2023: pp.8-14



Abdullah Sadık Tazegül1

, Ömer Sinan Şahin2

1Tüfekçioğulları Machine Company R&D Center, Karaman City, Türkiye
2Konya Technical University, Faculty of Engineering and Natural Sciences, Department of MechanicalEngineering, Konya City, Türkiye

Received: 15 December 2022
Revised: 20 February 2023
Accepted: 7 March 2023
Published: 31 March 2023


A wafer baking plate is set in wafer ovens, and wafer dough is baked to produce wafer sheets. Since wafer dough contains more than 50% water and is baked in a closed environment, it creates high pressure over time. This pressure puts considerable strain on the wafer baking plate and locking mechanisms and adversely affects the locking mechanism. In this case, it is necessary to calculate the stresses and displacements on the parts by modelling the loads and the boundary conditions specific to the problem for various plate locking mechanisms. This study used the finite element method to calculate and compare the stress and displacement values on two different locking mechanisms of a wafer baking plate. As a result of the analysis, the Von Mises stress value of the butterfly lock mechanism was 34.5% higher than the hook lock mechanism. The displacement value of the hook lock mechanism is 9.5% lower than the butterfly lock mechanism. Since the total contact area of the butterfly lock mechanism is shallow and the Von Mises stress value is higher than the other mechanism, it is predicted that the wear will be higher in continuous operation.


Wafer baking oven, wafer baking plate, plate locking mechanism, finite element analysis, mechanism evaluation


[1] S. Mukherjee, A. Asthana, M. Howarth, R. Mcneill, B. Frisby, Achieving Operational Excellence for Industrial Baking Ovens. Energy Procedia, 161, 2019: 395-402.
[2] Karl. F. Tifenbacher., The Technology of Wafers and Waffles I: Operational Aspects, first ed. Elsevier, 2017.
[3] A.S. Tazegül, M. Mayda, Lightweighting of frames in wafer ovens by finite element method. 6th  International Engineering Architecture and Design Congress, 17-18th  December 2020, Istanbul, Turkey, pp.145-153.
[4] R. Huber, G. Kalss, G. Schoenlechner, Waffle Production: Influence of Baking Plate Material on Sticking of Waffles. Journal of Food Science, 82(1), 2017: 61-68.
[5] M. Bitkin, A. S. Tazegül, M. Mayda, Parametric Design Optimization of a Plate Locking Mechanism in Wafer Ovens. 7th International Engineering Architecture and Design Congress, 21-22nd May 2021, (Online), pp.407-413.
[6] Automatic Wafer Baking Ovens. Nefamak, Karaman, Turkey. (Accessed 7.12.2022).
[7] R. Meral, İ.S. Doğan, Evaluation of Marketed Wafers in Terms of Quality and Ingredients. Yüzüncü Yıl University Journal of Agricultural Sciences, 14(2), 2004: 65-71. (In Turkish)
[8] N. Martínez‐Navarrete, G. Moraga, P. Talens, A. Chiralt, Water Sorption and The Plasticization Effect in Wafers. International Journal of Food Science & Technology, 39(5), 2004: 555-562.
[9] E. Çarşanba, K. Duerrschmid, G. Schleining, Assessment of Acoustic-Mechanical Measurements for Crispness of Wafer Products. Journal of Food Engineering, 229, 2018: 93-101.
[10] V. Dorohovych, M. Hrytsevich, N. Isakova, Effect of Gluten-Free Flour on Sensory, Physico-Chemical, Structural and Mechanical Properties of Wafer Batter and Waffles. Ukrainian Food Journal, 7(2), 2018: 253-263.
[11] Z. Li, Y. He, G. Xu, D. Shi, X. Yang, A Fatigue Life Estimation Approach Considering the Effect of Geometry and Stress Sensitivity. Theoretical and Applied Fracture Mechanics, 112, 2021, 102915.
[12] Ö. S. Şahin, M. H. Aksoy, A. S. Tazegül, Numerical Investigation of Thermal and Mechanical Behavior of Wafer Mold. X International Conference Industrial Engineering and Environmental Protection (IIZS 2020), 8-9th October 2020, Zrenjanin, Serbia, pp.62-69.
[13] Ş. Canay, N. Hersek, I. Akpınar, Z. Aşık, Comparison of Stress Distribution Around Vertical and Angled Implants with Finite Element Analysis. Quintessence International, 27(9), 1996: 591-595.
[14] S. Subrot Panigrahi, C.B. Singh, J. Fielke, D. Zare, Modeling of Heat and Mass Transfer Within the Grain Storage Ecosystem Using Numerical Methods: A review. Drying Technology, 38(13), 2020: 1677-1697.
[15] M. Mukama, A. Ambaw, U.L. Opara, Advances in Design and Performance Evaluation of Fresh Fruit Ventilated Distribution Packaging: A Review. Food Packaging and Shelf Life, 24, 2020: 100472.
[16] S. Wang, H. Zhang, H. Chen, Y. Zhong, X. Yue, Process Analysis and Optimization of Open-Width Fabric Continuous Drying Based on Numerical Simulation. Textile Research Journal, 91(7-8), 2021: 925-949.
[17] Z. Zhu, Y. Li, D.-W. Sun, H.-W. Wang, Developments of Mathematical Models for Simulating Vacuum Cooling Processes for Food Products – A Review. Critical Reviews in Food Science and Nutrition, 59(5), 2019: 715-727.
[18] T. Fadiji, S.-H.M. Ashtiani, D.I. Onwude, Z. Li, U.L. Opara, Finite Element Method for Freezing and Thawing Industrial Food Processes. Foods, 10(4), 2021: 869.
[19] X. Li, J. Zhang, C. Liao, H. Chen, Y. Luo, X. Li, Mathematical Simulation and Design of a Rectangular Cavity of Microwave Pretreatment Equipment Used for Wood Modification. Bioresources, 10(1), 2015: 527-537.
[20] A.M. Castro, E.Y. Mayorga, F.L. Moreno, Mathematical Modelling of Convective Drying of Fruits: A Review. Journal of Food Engineering, 223, 2018: 152-167.

This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License (CC BY-NC 4.0)

Volume 2
Number 1
March 2023.



How to Cite

A.S. Tazegül, Ö.S. Şahin, Comparison of Two Different Wafer Baking Plate Locking Mechanisms in Wafer Furnaces in Terms of Stresses. Advanced Engineering Letters, 2(1), 2023: 8-14.

More Citation Formats

Tazegül, A. S., & Şahin, Ö. S. (2023). Comparison of Two Different Wafer Baking Plate Locking Mechanisms in Wafer Furnaces in Terms of Stresses. Advanced Engineering Letters2(1), 8–14.

Tazegül, Abdullah Sadık, and Ömer Sinan Şahin. “Comparison of Two Different Wafer Baking Plate Locking Mechanisms in Wafer Furnaces in Terms of Stresses.” Advanced Engineering Letters, vol. 2, no. 1, 2023, pp. 8–14,

Tazegül, Abdullah Sadık, and Ömer Sinan Şahin. 2023. “Comparison of Two Different Wafer Baking Plate Locking Mechanisms in Wafer Furnaces in Terms of Stresses.” Advanced Engineering Letters 2 (1): 8–14.

Tazegül, A.S. and Şahin, Ö.S. (2023). Comparison of Two Different Wafer Baking Plate Locking Mechanisms in Wafer Furnaces in Terms of Stresses. Advanced Engineering Letters, 2(1), pp.8–14. doi: 10.46793/adeletters.2023.2.1.2.